Skip to content

Shandas among three to share patent for new smart material

The CU Technology Transfer Office is pleased to announce that researchers from CU’s Boulder, Anschutz and Denver campuses have been awarded a patent for improved shape memory polymers, a ‘smart material’ used in many next-generation implantable medical devices. The inventors on the patent are Christopher Bowman (CU-Boulder, ChBE), Robin Shandas (CU Denver, Bioengineering; CU Anschutz, Pediatrics; Children’s Hospital), Devatha Nair (CU Anschutz, Ophthalmology; former ChBE postdoc) and former ChBE research associate Neil Cramer.

U.S. 8,846,777, “Thiol-vinyl and thiol-yne systems for shape memory polymers,” was issued on September 30, 2014, and is part of a large portfolio of related patents prosecuted by TTO on behalf of CU.

Join us in congratulating these researchers on their achievement.

CU Denver Engineering, Design and Computing View All

At the CU Denver College of Engineering, Design and Computing, we focus on providing our students with a comprehensive engineering education at the undergraduate, graduate and professional level. Faculty conduct research that spans our five disciplines of civil, electrical and mechanical engineering, bioengineering, and computer science and engineering. The college collaborates with industry from around the state; our laboratories and research opportunities give students the hands-on experience they need to excel in the professional world.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google photo

You are commenting using your Google account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s

%d bloggers like this: