Shandas among three to share patent for new smart material
The CU Technology Transfer Office is pleased to announce that researchers from CU’s Boulder, Anschutz and Denver campuses have been awarded a patent for improved shape memory polymers, a ‘smart material’ used in many next-generation implantable medical devices. The inventors on the patent are Christopher Bowman (CU-Boulder, ChBE), Robin Shandas (CU Denver, Bioengineering; CU Anschutz, Pediatrics; Children’s Hospital), Devatha Nair (CU Anschutz, Ophthalmology; former ChBE postdoc) and former ChBE research associate Neil Cramer.
U.S. 8,846,777, “Thiol-vinyl and thiol-yne systems for shape memory polymers,” was issued on September 30, 2014, and is part of a large portfolio of related patents prosecuted by TTO on behalf of CU.
Join us in congratulating these researchers on their achievement.
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At the CU Denver College of Engineering, Design and Computing, we focus on providing our students with a comprehensive engineering education at the undergraduate, graduate and professional level. Faculty conduct research that spans our five disciplines of civil, electrical and mechanical engineering, bioengineering, and computer science and engineering. The college collaborates with industry from around the state; our laboratories and research opportunities give students the hands-on experience they need to excel in the professional world.
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