Electrical engineering faculty Vijay Harid and Mark Golkowski have been awarded Phase II of their DARPA program BLING (Broadband Low-frequency Imaging with Novel Generation). This significant award will provide their team $850K for the next 12 months to complete Phase II. Receiving a Phase II DARPA award is a significant event for not just our program or college, but for this campus.
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“There are so many organizations that promote social and technical growth,” Kelly said. “From National Society of Black Engineers (NSBE) , Society of Hispanic Professional Engineers (SHPE), to Society of Asian Scientists and Engineers (SASE), AI Student Association, LYNX Robotics … there is a club here for everyone. I have met so many friends outside of school, gained internship offers, and even industry connections from taking the first step to join these clubs.”
~ Mechanical engineering B.S graduate Kamaren Kelly
The College of Engineering, Design and Computing at CU Denver prepares students to solve real-world challenges at the intersection of technology, creativity, and community impact. Located in the heart of downtown Denver, the college combines hands-on learning, industry-connected research, and interdisciplinary collaboration across engineering, computer science, construction management, architecture, planning, and design. Through strong partnerships with Colorado employers and a focus on access, innovation, and career readiness, CEDC equips students to lead in rapidly evolving industries while shaping more sustainable, equitable, and connected communities.
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